Now that the OML community has passed its first birthday, it is time to see some real action, rather than just hear the hype. At the SMT show in Nuremberg, the first public demonstration of the live IoT connected line using OML will be shown, as part of the Fraunhofer “Future Packaging” exhibit. The “Future … Continue reading →
No doubt PCB assemblies are complex objects, especially considering its size. And that is actually our intention – to create maximum functions in the most efficient way possible. Achieving that though, comes with a set of challenges. Multiple components, different materials, a variety of functions and distinctive physical characteristic all need to be properly handled … Continue reading →
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