Now that the OML community has passed its first birthday, it is time to see some real action, rather than just hear the hype. At the SMT show in Nuremberg, the first public demonstration of the live IoT connected line using OML will be shown, as part of the Fraunhofer “Future Packaging” exhibit. The “Future … Continue reading →
In November last year, the first ever standard for traceability in electronics assembly was published by the IPC, in the form of IPC-1782. Mentor Graphics is proud to be a key part of the team that has put this standard together in record time, and in such a way as to be hugely beneficial to … Continue reading →
With less than a week to go before the IPC APEX show in San Diego, it is time to prepare and set expectations. Traditionally at these trade shows, the area of interest is on advancing machine technology, but this year, we are likely to see a swing of interest in favor of software, taking in … Continue reading →
With the birth of the Industry 4.0 era, there are great opportunities in our industry. But to turn these opportunities into actual benefits, the industry needs to take brave actions that will help embrace what this era is bringing. A strong standard needs to evolve, both in terms of adopting new ideas, and keeping pace with … Continue reading →
Next week in San Jose is the “IoM 2016 Conference”, hosted by Global SMT & Packaging and Scoop Communications. This is the first conference of its kind, very much focused on the ability to get started with the Internet of Manufacturing within the electronics industry. Mentor Graphics will introduce OML and other technologies related to … Continue reading →
APEX saw the first discussions of OML in an open environment, and what feedback we have had. Analysts and the press have been very positive about OML, seeing it as being the platform on which the Internet of Manufacturing for electronics should be based. In fact, there have been numerous inquiries about OML from outside … Continue reading →
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