The day after Fraunhofer Future Packaging Production Line

Previous posts have talked a lot about what to expect in the Fraunhofer Future Packaging Production line. We’ve talked about the importance of having a “critical mass” of adoption from the industry in order to help OML get the push it needs to make a real change in the industry.  We’ve also talked a lot … Continue reading

World’s-First IoT Live Public Demo With OML

Now that the OML community has passed its first birthday, it is time to see some real action, rather than just hear the hype. At the SMT show in Nuremberg, the first public demonstration of the live IoT connected line using OML will be shown, as part of the Fraunhofer “Future Packaging” exhibit. The “Future … Continue reading

APEX Show – It’s No Longer What you Have, But What You Are Doing With It

With less than a week to go before the IPC APEX show in San Diego, it is time to prepare and set expectations. Traditionally at these trade shows, the area of interest is on advancing machine technology, but this year, we are likely to see a swing of interest in favor of software, taking in … Continue reading

The Evolution of OML – From Vision To Reality

With the birth of the Industry 4.0 era, there are great opportunities in our industry. But to turn these opportunities into actual benefits, the industry needs to take brave actions that will help embrace what this era is bringing. A strong standard needs to evolve, both in terms of adopting new ideas, and keeping pace with … Continue reading

OML At The San Jose “Internet of Manufacturing” Conference

Next week in San Jose is the “IoM 2016 Conference”, hosted by Global SMT & Packaging and Scoop Communications. This is the first conference of its kind, very much focused on the ability to get started with the Internet of Manufacturing within the electronics industry. Mentor Graphics will introduce OML and other technologies related to … Continue reading